NG80960JF3V25
vs
5962F0150201QXA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP,
|
QFF,
|
| Pin Count |
132
|
132
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Intel
|
|
| Address Bus Width |
32
|
16
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
NO
|
| Clock Frequency-Max |
25 MHz
|
12 MHz
|
| External Data Bus Width |
32
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PQFP-G132
|
S-CQFP-F132
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
132
|
132
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFP
|
QFF
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
25 MHz
|
12 MHz
|
| Supply Voltage-Max |
3.45 V
|
5.5 V
|
| Supply Voltage-Min |
3.15 V
|
4.5 V
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| JESD-609 Code |
|
e0
|
| Length |
|
24.13 mm
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Screening Level |
|
MIL-PRF-38535 Class Q
|
| Seated Height-Max |
|
2.794 mm
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
0.635 mm
|
| Total Dose |
|
300k Rad(Si) V
|
| Width |
|
24.13 mm
|
|
|
|
Compare NG80960JF3V25 with alternatives
Compare 5962F0150201QXA with alternatives