NLVVHC1G66DFT1G
vs
MC74VHC1GT66DFT1
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
| Manufacturer Package Code |
419A-02
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| Input Voltage-Max |
5.5 V
|
|
| Input Voltage-Min |
|
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
e0
|
| Length |
2 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
|
| Normal Position |
NO
|
NO
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Off-state Isolation-Nom |
80 dB
|
40 dB
|
| On-state Resistance-Max (Ron) |
60 Ω
|
30 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP5/6,.08
|
TSSOP6,.08
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Current-Max (Isup) |
0.04 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
50 ns
|
10 ns
|
| Switch-on Time-Max |
50 ns
|
10 ns
|
| Switching |
MAKE-BEFORE-BREAK
|
MAKE-BEFORE-BREAK
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
1
|
5
|
| Rohs Code |
|
No
|
| Package Description |
|
SOT-353, SC-88A, 5 PIN
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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