NMC93C66EN vs M93C66-BN3P/S feature comparison

NMC93C66EN Texas Instruments

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M93C66-BN3P/S STMicroelectronics

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 DIP,
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.5 MHz 2 MHz
Data Retention Time-Min 40
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0
Length 9.817 mm 9.27 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X16 256X16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.33 mm
Serial Bus Type MICROWIRE MICROWIRE
Standby Current-Max 0.0001 A
Supply Current-Max 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 5 ms
Write Protection SOFTWARE
Base Number Matches 2 1
Alternate Memory Width 8
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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