NT5CC128M16JR-EKI vs MYX4DDR3L128M16JT-125 feature comparison

NT5CC128M16JR-EKI Nanya Technology Corporation

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MYX4DDR3L128M16JT-125 Micross Components

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NANYA TECHNOLOGY CORP MICROSS COMPONENTS
Package Description TFBGA-96 TFBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Date Of Intro 2017-11-30
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e1
Length 13 mm 14 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type DDR DRAM DDR3L DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 96 96
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 95 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128MX16 128MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.45 V 1.45 V
Supply Voltage-Min (Vsup) 1.283 V 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V 1.35 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm 8 mm
Base Number Matches 1 2

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