NX3DV3899HR,115
vs
NX3DV3899HR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
QFN
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT1039-2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Analog IC - Other Type |
DPDT
|
DPDT
|
| JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| On-state Resistance-Max (Ron) |
10 Ω
|
8 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
LCC16,.12SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Switch-on Time-Max |
90 ns
|
120 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Base Number Matches |
1
|
3
|
| Package Description |
|
HVQCCN,
|
| Length |
|
3 mm
|
| Number of Channels |
|
2
|
| Off-state Isolation-Nom |
|
70 dB
|
| Seated Height-Max |
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
|
4.3 V
|
| Supply Voltage-Min (Vsup) |
|
1.4 V
|
| Supply Voltage-Nom (Vsup) |
|
1.65 V
|
| Switch-off Time-Max |
|
90 ns
|
| Technology |
|
CMOS
|
| Width |
|
3 mm
|
|
|
|
Compare NX3DV3899HR,115 with alternatives
Compare NX3DV3899HR with alternatives