OXPCIE958-FBAG
vs
XIO3130IZHC
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PLX TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TFBGA,
|
GREEN, PLASTIC, BGA-196
|
| Pin Count |
176
|
196
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
100 MHz
|
100 MHz
|
| JESD-30 Code |
S-PBGA-B176
|
S-PBGA-B196
|
| Length |
13 mm
|
15 mm
|
| Number of Terminals |
176
|
196
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.5 mm
|
| Supply Voltage-Max |
1.32 V
|
1.65 V
|
| Supply Voltage-Min |
1.08 V
|
1.35 V
|
| Supply Voltage-Nom |
1.2 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
13 mm
|
15 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Bus Compatibility |
|
PCI
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
BGA196,14X14,40
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare OXPCIE958-FBAG with alternatives
Compare XIO3130IZHC with alternatives