P0805Y1022WBW
vs
CMP080510K20.1%10PPM/KNP5
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
MICROTECH GMBH ELECTRONIC
|
| Package Description |
CHIP
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00.30
|
|
| Additional Feature |
ANTI-SULFUR, HIGH PRECISION
|
|
| Construction |
Rectangular
|
Chip
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
1.91 mm
|
2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.27 mm
|
1.25 mm
|
| Packing Method |
WAFFLE PACK
|
Tape
|
| Rated Power Dissipation (P) |
0.2 W
|
0.2 W
|
| Rated Temperature |
70 °C
|
|
| Resistance |
10200 Ω
|
10200 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0805
|
0805
|
| Surface Mount |
YES
|
|
| Technology |
THIN FILM
|
THIN FILM
|
| Temperature Coefficient |
10 ppm/°C
|
10 ppm/°C
|
| Terminal Finish |
Tin/Lead/Silver - with Nickel barrier
|
Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
|
| Tolerance |
0.05%
|
0.1%
|
| Working Voltage |
150 V
|
150 V
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e3
|
| Series |
|
CMP
|
|
|
|
Compare P0805Y1022WBW with alternatives
Compare CMP080510K20.1%10PPM/KNP5 with alternatives