P4C168-25FMB vs P4C168-25CM feature comparison

P4C168-25FMB Pyramid Semiconductor Corporation

Buy Now Datasheet

P4C168-25CM Pyramid Semiconductor Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DFP DIP
Package Description CERAMIC, PACKAGE-20 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code R-CDFP-F20 R-CDIP-T20
JESD-609 Code e0 e0
Length 13.716 mm 25.908 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 4KX4 4KX4
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 2.286 mm 5.08 mm
Supply Current-Max 0.12 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 8.382 mm 7.62 mm
Base Number Matches 1 2

Compare P4C168-25FMB with alternatives

Compare P4C168-25CM with alternatives