P89LV51RC2BN vs LP87C52-24 feature comparison

P89LV51RC2BN NXP Semiconductors

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LP87C52-24 Intel Corporation

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEL CORP
Part Package Code DIP DIP
Package Description 0.600 INCH, PLASTIC, MO-015, SOT-129-1, DIP-40 DIP,
Pin Count 40 40
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051
Clock Frequency-Max 33 MHz 24 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Length 52 mm 52.26 mm
Number of I/O Lines 32 32
Number of Terminals 40 40
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 1024
ROM (words) 32768
ROM Programmability FLASH OTPROM
Seated Height-Max 4.7 mm 5.08 mm
Speed 33 MHz 24 MHz
Supply Current-Max 30 mA 56 mA
Supply Voltage-Max 3.6 V 6 V
Supply Voltage-Min 3 V 4 V
Supply Voltage-Nom 3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1

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Compare LP87C52-24 with alternatives