PC28F128P33B85 vs RC28F128P33B85D feature comparison

PC28F128P33B85 Micron Technology Inc

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RC28F128P33B85D Micron Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description TBGA, BGA-64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 85 ns 85 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Length 10 mm 10 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V 3 V
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE NOR TYPE
Width 8 mm 8 mm
Base Number Matches 3 2
Pbfree Code No
Part Package Code BGA
Pin Count 64
JESD-609 Code e0
Qualification Status Not Qualified
Terminal Finish TIN LEAD SILVER

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