PESD12VV1BL,315
vs
PESD5V0L1BA,135
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DFN
|
SOD
|
| Package Description |
ULTRA SMALL, LEADLESS, PLASTIC, DFN1006-2, 2 PIN
|
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
SOD882
|
SOD323
|
| Reach Compliance Code |
compliant
|
compliant
|
| Breakdown Voltage-Max |
16.8 V
|
8.2 V
|
| Breakdown Voltage-Min |
14.6 V
|
7 V
|
| Breakdown Voltage-Nom |
15.7 V
|
7.6 V
|
| Clamping Voltage-Max |
38 V
|
33 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
R-PBCC-N2
|
R-PDSO-F2
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Peak Rev Power Dis-Max |
290 W
|
500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Reference Standard |
AEC-Q101; IEC-60134
|
|
| Rep Pk Reverse Voltage-Max |
12 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Additional Feature |
|
LOW CAPACITANCE
|
| Reverse Current-Max |
|
1 µA
|
| Reverse Test Voltage |
|
5 V
|
|
|
|
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