PF38F30W0YHQ0 vs K8A6315ETC-FE7C0 feature comparison

PF38F30W0YHQ0 Numonyx Memory Solutions

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K8A6315ETC-FE7C0 Samsung Semiconductor

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NUMONYX SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description TFBGA, TFBGA,
Pin Count 88 88
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Boot Block BOTTOM TOP
Clock Frequency-Max (fCLK) 54 MHz
JESD-30 Code R-PBGA-B88 R-PBGA-B88
Length 10 mm 11 mm
Memory Density 134217728 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 8388608 words 4194304 words
Number of Words Code 8000000 4000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -25 °C
Organization 8MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 8 mm 8 mm
Base Number Matches 2 1
Access Time-Max 70 ns
Additional Feature TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

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Compare K8A6315ETC-FE7C0 with alternatives