PIC16CR54T-LPESS
vs
PIC16CR54-LPSP
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Active
|
| Part Package Code |
SSOP
|
DIP
|
| Package Description |
Ssop,
|
Dip,
|
| Pin Count |
20
|
18
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
No
|
No
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
No
|
No
|
| CPU Family |
Pic
|
Pic
|
| Clock Frequency-Max |
0.04 Mhz
|
0.04 Mhz
|
| DAC Channels |
No
|
No
|
| DMA Channels |
No
|
No
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDIP-T18
|
| JESD-609 Code |
e3
|
e3
|
| Length |
7.2 Mm
|
22.987 Mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
20
|
12
|
| Number of Terminals |
20
|
18
|
| Number of Timers |
1
|
1
|
| On Chip Program ROM Width |
12
|
12
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
No
|
No
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
SSOP
|
DIP
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Shrink Pitch
|
In-Line
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
25
|
25
|
| ROM (words) |
512
|
512
|
| ROM Programmability |
Mrom
|
Mrom
|
| Seated Height-Max |
2 Mm
|
4.064 Mm
|
| Speed |
0.04 Mhz
|
0.04 Mhz
|
| Supply Voltage-Max |
6.25 V
|
6.25 V
|
| Supply Voltage-Min |
2.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
Yes
|
No
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Automotive
|
Commercial
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
Gull Wing
|
Through-Hole
|
| Terminal Pitch |
0.65 Mm
|
2.54 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Width |
5.3 Mm
|
7.62 Mm
|
| uPs/uCs/Peripheral ICs Type |
Microcontroller, Risc
|
Microcontroller, Risc
|
| Base Number Matches |
1
|
1
|
|
|
|