PIC18F14K50-I/SO
vs
PIC18LF14K50-I/MQ
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
Sop, Sop20,.4
|
Hvqccn, Lcc20,.20sq,25
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
SOIC-20
|
QFN-20
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
3A991.a.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.15
|
8542.31.00.01
|
| Factory Lead Time |
7 Weeks
|
7 Weeks
|
| Has ADC |
Yes
|
Yes
|
| Additional Feature |
Operates At 1.8 V Minimum Supply At 20 Mhz
|
Operates At 1.8 V Minimum Supply At 20 Mhz
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
Yes
|
Yes
|
| CPU Family |
Pic
|
Pic
|
| Clock Frequency-Max |
48 Mhz
|
48 Mhz
|
| DAC Channels |
Yes
|
Yes
|
| DMA Channels |
No
|
No
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G20
|
S-PQCC-N20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
12.8 Mm
|
5 Mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of I/O Lines |
17
|
17
|
| Number of Terminals |
20
|
20
|
| On Chip Program ROM Width |
8
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
Yes
|
Yes
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
SOP
|
HVQCCN
|
| Package Equivalence Code |
SOP20,.4
|
LCC20,.20SQ,25
|
| Package Shape |
Rectangular
|
Square
|
| Package Style |
Small Outline
|
Chip Carrier, Heat Sink/Slug, Very Thin Profile
|
| Peak Reflow Temperature (Cel) |
250
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
768
|
768
|
| ROM (words) |
16384
|
8192
|
| ROM Programmability |
Flash
|
Flash
|
| Seated Height-Max |
2.65 Mm
|
1 Mm
|
| Speed |
48 Mhz
|
48 Mhz
|
| Supply Current-Max |
15 Ma
|
12 Ma
|
| Supply Voltage-Max |
5.5 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
Gull Wing
|
No Lead
|
| Terminal Pitch |
1.27 Mm
|
0.65 Mm
|
| Terminal Position |
Dual
|
Quad
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
7.5 Mm
|
5 Mm
|
| uPs/uCs/Peripheral ICs Type |
Microcontroller, Risc
|
Microcontroller, Risc
|
| Base Number Matches |
1
|
1
|
|
|
|