PIC24F08KL301-I/ML vs PIC24F08KL301T-I/SO feature comparison

PIC24F08KL301-I/ML Microchip Technology Inc

Buy Now Datasheet

PIC24F08KL301T-I/SO Microchip Technology Inc

Buy Now Datasheet
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code QFN SOIC
Package Description QFN-20 7.50 MM, LEAD FREE, PLASTIC, SOIC-20
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO OPERATES 1.8V AT 8MHZ ALSO OPERATES 1.8V AT 8MHZ
Address Bus Width
Bit Size 16 16
CPU Family PIC24 PIC24
Clock Frequency-Max 32 MHz 32 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQCC-N20 R-PDSO-G20
Number of I/O Lines 18 18
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HQCCN SOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG SMALL OUTLINE
ROM Programmability FLASH FLASH
Speed 32 MHz 32 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Position QUAD DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e3
Length 12.8 mm
Moisture Sensitivity Level 1
On Chip Program ROM Width 24
Package Equivalence Code SOP20,.4
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 1024
ROM (words) 2730
Seated Height-Max 2.65 mm
Supply Current-Max 12 mA
Terminal Finish Matte Tin (Sn)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 7.5 mm

Compare PIC24F08KL301-I/ML with alternatives

Compare PIC24F08KL301T-I/SO with alternatives