PMBD353,235 vs MMBD353LT3 feature comparison

PMBD353,235 NXP Semiconductors

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MMBD353LT3 Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code TO-236
Package Description PLASTIC, TO-236AB, 3 PIN R-PDSO-G3
Pin Count 3
Manufacturer Package Code SOT23
Reach Compliance Code compliant unknown
HTS Code 8541.10.00.70 8541.10.00.60
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Capacitance-Max 1 pF 1 pF
Diode Element Material SILICON SILICON
Diode Type MIXER DIODE MIXER DIODE
Forward Voltage-Max (VF) 0.6 V
Frequency Band ULTRA HIGH FREQUENCY ULTRA HIGH FREQUENCY
JEDEC-95 Code TO-236AB TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 2 2
Number of Terminals 3 3
Operating Temperature-Max 100 °C 125 °C
Output Current-Max 0.03 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 4 V
Surface Mount YES YES
Technology SCHOTTKY
Terminal Finish TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 2 4
ECCN Code EAR99

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