PPC460EX-NTA800T
vs
MCC3E0RX180WB0B
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
BGA,
|
| Pin Count |
728
|
728
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
100 MHz
|
180 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PBGA-B728
|
S-CBGA-B728
|
| Length |
35 mm
|
29 mm
|
| Low Power Mode |
YES
|
NO
|
| Number of Terminals |
728
|
728
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
3.39 mm
|
| Speed |
800 MHz
|
180 MHz
|
| Supply Voltage-Max |
1.3 V
|
1.26 V
|
| Supply Voltage-Min |
1.2 V
|
1.14 V
|
| Supply Voltage-Nom |
1.25 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
35 mm
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare PPC460EX-NTA800T with alternatives
Compare MCC3E0RX180WB0B with alternatives