PY26325PM vs X88C64D feature comparison

PY26325PM Pyramid Semiconductor Corporation

Buy Now Datasheet

X88C64D Xicor Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP XICOR INC
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, DIP-24 HERMETIC SEALED, CERDIP-24
Pin Count 24
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 25 ns 120 ns
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 31.877 mm 32.07 mm
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.334 mm 5.72 mm
Supply Current-Max 0.14 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 15.24 mm
Base Number Matches 2 4
Additional Feature PAGE WRITE
Command User Interface NO
Data Polling NO
Package Equivalence Code DIP24,.6
Page Size 32 words
Programming Voltage 5 V
Standby Current-Max 0.0005 A
Toggle Bit YES

Compare PY26325PM with alternatives

Compare X88C64D with alternatives