R5F56317DDBG
vs
R5F563NWGDFC
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Package Description |
LFBGA, BGA176,15X15,32
|
LQFP-176
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
24
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
CPU Family |
RX631
|
RX
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-PBGA-B176
|
S-PQFP-G176
|
Length |
13 mm
|
24 mm
|
Number of I/O Lines |
134
|
134
|
Number of Terminals |
176
|
176
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFQFP
|
Package Equivalence Code |
BGA176,15X15,32
|
QFP176,1.0SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
131072
|
196608
|
ROM (words) |
393216
|
1048576
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.4 mm
|
1.7 mm
|
Speed |
100 MHz
|
100 MHz
|
Supply Current-Max |
100 mA
|
100 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.7 V
|
2.7 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
13 mm
|
24 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
1
|
Additional Feature |
|
ALSO HAVING 8-CH 10-BIT A/D CONVERTER
|
Number of DMA Channels |
|
6
|
Number of Timers |
|
26
|
|
|
|
Compare R5F56317DDBG with alternatives
Compare R5F563NWGDFC with alternatives