S25FL002D0FMAI001
vs
S25FL002D0FMFI013
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SPANSION INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.150 INCH, PLASTIC, MS-012AA, SO-8
|
,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
25 MHz
|
|
| Data Retention Time-Min |
20
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-G8
|
|
| Length |
4.8895 mm
|
|
| Memory Density |
2097152 bit
|
|
| Memory IC Type |
FLASH
|
|
| Memory Width |
1
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Number of Words |
2097152 words
|
|
| Number of Words Code |
2000000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2MX1
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Parallel/Serial |
SERIAL
|
|
| Programming Voltage |
3 V
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.7526 mm
|
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.000003 A
|
|
| Supply Current-Max |
0.02 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Type |
NOR TYPE
|
|
| Width |
3.8989 mm
|
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
2
|
3
|
|
|
|
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