S25FL064LABMFA010
vs
S25FL064LABMFM010
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Package Description |
SOIC-8
|
SOIC-8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.1.A
|
3A991.B.1.A
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Date Of Intro |
2016-09-26
|
2016-09-26
|
Additional Feature |
IT ALSO HAVE X1 MEMORY WIDTH
|
IT ALSO HAVE X1 MEMORY WIDTH
|
Alternate Memory Width |
2
|
2
|
Clock Frequency-Max (fCLK) |
108 MHz
|
108 MHz
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
5.28 mm
|
5.28 mm
|
Memory Density |
67108864 bit
|
67108864 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
8388608 words
|
8388608 words
|
Number of Words Code |
8000000
|
8000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
8MX8
|
8MX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Programming Voltage |
3 V
|
3 V
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Seated Height-Max |
2.16 mm
|
2.16 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
5.28 mm
|
5.28 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare S25FL064LABMFA010 with alternatives
Compare S25FL064LABMFM010 with alternatives