S25FL064LABNFI043 vs W25X64VZPI feature comparison

S25FL064LABNFI043 Cypress Semiconductor

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W25X64VZPI Winbond Electronics Corp

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP WINBOND ELECTRONICS CORP
Package Description USON-8 HVSON,
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Date Of Intro 2017-05-15
Additional Feature IT IS ALSO CONFIGURED AS 64M X 1
Alternate Memory Width 2
Clock Frequency-Max (fCLK) 108 MHz 33 MHz
JESD-30 Code S-PDSO-N8 R-PDSO-N8
JESD-609 Code e3
Length 4 mm 6 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON HVSON
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Seated Height-Max 0.6 mm 0.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4 mm 5 mm
Base Number Matches 2 1
Part Package Code SON
Pin Count 8
Qualification Status Not Qualified
Type NOR TYPE

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