S25FL128SDSBHI213
vs
S25FL128SDSBHI213
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
CYPRESS SEMICONDUCTOR CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
8 Weeks
|
|
| Samacsys Manufacturer |
Infineon
|
|
| Clock Frequency-Max (fCLK) |
80 MHz
|
80 MHz
|
| JESD-30 Code |
R-PBGA-B24
|
R-PBGA-B24
|
| Length |
8 mm
|
8 mm
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
16MX8
|
16MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
TBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Programming Voltage |
3 V
|
3 V
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A991.B.1.A
|
| HTS Code |
|
8542.32.00.51
|
| Boot Block |
|
BOTTOM
|
| Supply Current-Max |
|
0.1 mA
|
| Type |
|
NOR TYPE
|
|
|
|