S29AL016J70BHN032 vs S29AL016J70BFN012 feature comparison

S29AL016J70BHN032 Spansion

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S29AL016J70BFN012 Spansion

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC SPANSION INC
Package Description , VFBGA, BGA48,6X8,32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Memory IC Type FLASH FLASH
Programming Voltage 3 V 3 V
Base Number Matches 2 2
Rohs Code Yes
Part Package Code BGA
Pin Count 48
Access Time-Max 70 ns
Additional Feature TOP BOOT BLOCK
Alternate Memory Width 8
Boot Block TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B48
JESD-609 Code e1
Length 8.15 mm
Memory Density 16777216 bit
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 1,2,1,31
Number of Terminals 48
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 1MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA48,6X8,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1 mm
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES
Type NOR TYPE
Width 6.15 mm

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