S29GL256P10TAIR23 vs S29GL256P10TFIR13 feature comparison

S29GL256P10TAIR23 Cypress Semiconductor

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S29GL256P10TFIR13 Spansion

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description 20 X 14 MM, MO-142EC, TSOP-56 HTSSOP,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 100 ns 100 ns
Boot Block BOTTOM/TOP
JESD-30 Code R-PDSO-G56 R-PDSO-G56
Length 18.4 mm 18.4 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 16MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTSSOP HTSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Current-Max 0.11 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 14 mm 14 mm
Base Number Matches 2 2
Part Package Code TSOP1
Pin Count 56

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