S29GL256P90TFIV20
vs
S29GL256P90TFIR23
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SPANSION INC
|
| Package Description |
20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56
|
20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
90 ns
|
90 ns
|
| Boot Block |
BOTTOM/TOP
|
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
| Length |
18.4 mm
|
18.4 mm
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
56
|
56
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
16MX16
|
16MX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
HTSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Current-Max |
0.11 mA
|
0.11 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
TSOP1
|
| Pin Count |
|
56
|
| Alternate Memory Width |
|
8
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
YES
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Number of Sectors/Size |
|
256
|
| Package Equivalence Code |
|
TSSOP56,.8,20
|
| Page Size |
|
8/16 words
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
128K
|
| Standby Current-Max |
|
0.000005 A
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Toggle Bit |
|
YES
|
|
|
|
Compare S29GL256P90TFIV20 with alternatives
Compare S29GL256P90TFIR23 with alternatives