S34ML01G200BHB003 vs NAND01GW3B2BZA1E feature comparison

S34ML01G200BHB003 SkyHigh Memory Limited

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NAND01GW3B2BZA1E STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Transferred
Package Description BGA-63 TFBGA, BGA63,10X12,32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 11 mm 11 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 105 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Programming Voltage 3 V 3 V
Screening Level AEC-Q100
Seated Height-Max 1 mm 1.05 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type SLC NAND TYPE
Width 9 mm 9 mm
Base Number Matches 2 3
Source Content uid NAND01GW3B2BZA1E
Part Package Code BGA
Pin Count 63
Access Time-Max 25000 ns
Command User Interface YES
Data Polling NO
Number of Sectors/Size 1K
Package Equivalence Code BGA63,10X12,32
Page Size 2K words
Power Supplies 3/3.3 V
Qualification Status Not Qualified
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.02 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit NO

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