S34ML02G100TFI000 vs MT29F2G08ABAGAWP-IT:GTR feature comparison

S34ML02G100TFI000 SkyHigh Memory Limited

Buy Now Datasheet

MT29F2G08ABAGAWP-IT:GTR Micron Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer SKYHIGH MEMORY LTD MICRON TECHNOLOGY INC
Package Description TSOP1-48 ,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 25 ns
Command User Interface YES
Data Polling NO
Data Retention Time-Min 10
JESD-30 Code R-PDSO-G48
JESD-609 Code e3
Length 18.4 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Sectors/Size 2K
Number of Terminals 48
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256MX8 256MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size 2K words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3.3 V
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit YES
Type SLC NAND TYPE SLC NAND TYPE
Width 12 mm
Write Cycle Time-Max (tWC) 0.000025 ms
Base Number Matches 3 1
Date Of Intro 2020-07-21

Compare S34ML02G100TFI000 with alternatives

Compare MT29F2G08ABAGAWP-IT:GTR with alternatives