S54LS132W vs 54LS132/BDAJC feature comparison

S54LS132W NXP Semiconductors

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54LS132/BDAJC Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description DFP, FL14,.3 DFP, FL14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-CDFP-F14 R-GDFP-F14
JESD-609 Code e0 e0
Load Capacitance (CL) 15 pF 15 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.008 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DFP DFP
Package Equivalence Code FL14,.3 FL14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Power Supply Current-Max (ICC) 14 mA 14 mA
Prop. Delay@Nom-Sup 22 ns 52 ns
Propagation Delay (tpd) 22 ns 47 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 3
Rohs Code No
Part Package Code DFP
Pin Count 14
Length 9.65 mm
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 2.15 mm
Width 6.415 mm

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Compare 54LS132/BDAJC with alternatives