S71JL128HC0BFW01
vs
AM42BDS640AGBD9FT
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SPANSION INC
|
Package Description |
LFBGA, BGA88,10X12,32
|
LFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
70 ns
|
|
Additional Feature |
SRAM IS ORGANISED AS 4KX16
|
STATIC RAM IS ORGANISED AS 1M X 16
|
JESD-30 Code |
R-PBGA-B88
|
R-PBGA-B93
|
Length |
11.6 mm
|
11.6 mm
|
Memory Density |
134217728 bit
|
67108864 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
16
|
16
|
Mixed Memory Type |
FLASH+PSRAM
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
88
|
93
|
Number of Words |
8388608 words
|
4194304 words
|
Number of Words Code |
8000000
|
4000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-40 °C
|
Organization |
8MX16
|
4MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA88,10X12,32
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Supply Voltage-Max (Vsup) |
3.3 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
4
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
93
|
JESD-609 Code |
|
e1
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare S71JL128HC0BFW01 with alternatives
Compare AM42BDS640AGBD9FT with alternatives