S71NS256NB0BJWVN1 vs S71NS256NB0BJWVN3 feature comparison

S71NS256NB0BJWVN1 Cypress Semiconductor

Buy Now Datasheet

S71NS256NB0BJWVN3 Spansion

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description 10 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60 11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
JESD-30 Code R-PBGA-B60 R-PBGA-B60
JESD-609 Code e2 e2
Length 11 mm 11 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 60 60
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 16MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) TIN SILVER COPPER NICKEL
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 10 mm 10 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 60
Additional Feature PSRAM IS ORGANIZED AS 16M X 16

Compare S71NS256NB0BJWVN1 with alternatives

Compare S71NS256NB0BJWVN3 with alternatives