S82S130F vs S82S131F883B feature comparison

S82S130F NXP Semiconductors

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S82S131F883B Signetics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP SIGNETICS CORP
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 70 ns
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Memory Density 2048 bit 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X4 512X4
Output Characteristics OPEN-COLLECTOR
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 3
Rohs Code No
JESD-609 Code e0
Package Code DIP
Package Equivalence Code DIP16,.3
Screening Level MIL-STD-883 Class B
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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Compare S82S131F883B with alternatives