SA6.5CA-AP
vs
SMAJP4KE7.5CAE3
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICROSEMI CORP
|
| Part Package Code |
DO-15
|
DO-214AC
|
| Package Description |
O-PALF-W2
|
R-PDSO-C2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Additional Feature |
EXCELLENT CLAMPING CAPABILITY
|
|
| Breakdown Voltage-Max |
7.98 V
|
7.88 V
|
| Breakdown Voltage-Min |
7.22 V
|
7.13 V
|
| Breakdown Voltage-Nom |
7.6 V
|
7.5 V
|
| Case Connection |
ISOLATED
|
|
| Clamping Voltage-Max |
11.2 V
|
11.3 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-15
|
DO-214AC
|
| JESD-30 Code |
O-PALF-W2
|
R-PDSO-C2
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Peak Rev Power Dis-Max |
500 W
|
400 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
3 W
|
1.52 W
|
| Reference Standard |
UL RECOGNIZED
|
|
| Rep Pk Reverse Voltage-Max |
6.5 V
|
6.4 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
WIRE
|
C BEND
|
| Terminal Position |
AXIAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
NOT SPECIFIED
|
| Base Number Matches |
2
|
20
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare SA6.5CA-AP with alternatives
Compare SMAJP4KE7.5CAE3 with alternatives