SDINBDG4-8G-I1T
vs
MTFC8GAKAJCN-4MIT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
WESTERN DIGITAL CORP
|
MICRON TECHNOLOGY INC
|
| Package Description |
TFBGA-153
|
VFBGA-153
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Clock Frequency-Max (fCLK) |
200 MHz
|
52 MHz
|
| Data Retention Time-Min |
1
|
|
| Endurance |
3000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PBGA-B153
|
R-PBGA-B153
|
| Length |
13 mm
|
13 mm
|
| Memory Density |
68719476736 bit
|
68719476736 bit
|
| Memory IC Type |
FLASH CARD
|
FLASH CARD
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
153
|
153
|
| Number of Words |
8589934592 words
|
8589934592 words
|
| Number of Words Code |
8000000000
|
8000000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Organization |
8GX8
|
8GX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA153,14X14,20
|
BGA153,14X14,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3.3 V
|
|
| Seated Height-Max |
0.8 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Type |
MLC NAND TYPE
|
MLC NAND TYPE
|
| Width |
11.5 mm
|
11.5 mm
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Samacsys Manufacturer |
|
Micron
|
| Command User Interface |
|
NO
|
| Data Polling |
|
NO
|
| JESD-609 Code |
|
e1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Toggle Bit |
|
NO
|
|
|
|
Compare SDINBDG4-8G-I1T with alternatives
Compare MTFC8GAKAJCN-4MIT with alternatives