SED1330FBB vs SED1330FBB feature comparison

SED1330FBB Epson Electronics America Inc

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SED1330FBB Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer S-MOS SYSTEMS INTEGRATED SILICON SOLUTION INC
Part Package Code QFP
Package Description , QFP,
Pin Count 60
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Epson Timing
Address Bus Width 1
Bus Compatibility 6800; 8080 6800; 8080
Display Configuration 128 X 32 CHARACTERS 640 X 256 PIXELS
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G60 S-PQFP-G60
Number of Terminals 60 60
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
Supply Current-Max 12 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 2.7 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type DISPLAY CONTROLLER, DOT MATRIX LCD DISPLAY DISPLAY CONTROLLER, DOT MATRIX LCD DISPLAY
Base Number Matches 1 1
Rohs Code No
Clock Frequency-Max 10 MHz
Length 14 mm
Package Code QFP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 1 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm