SIP32416DNP-T1-GE4
vs
MIC2026-2BM
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY SILICONIX
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
DFN
|
SOIC
|
| Package Description |
HVSON, SOLCC8,.08,20
|
SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Vishay
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| Input Voltage-Max |
5.5 V
|
|
| Input Voltage-Min |
1.1 V
|
|
| Input Voltage-Nom |
5 V
|
|
| JESD-30 Code |
S-PDSO-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e0
|
| Length |
2 mm
|
4.93 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
2.4 A
|
|
| Output Voltage-Nom |
5 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
SOP
|
| Package Equivalence Code |
SOLCC8,.08,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Seated Height-Max |
0.6 mm
|
1.73 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.1 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Palladium/Gold (Pd/Au)
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2 mm
|
3.94 mm
|
| Base Number Matches |
2
|
3
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
|
|
|
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