SIS892ADN-T1-GE3
vs
SIS892ADN-T1-GE3
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY SILICONIX
|
Package Description |
HALEGEN FREE AND ROHS COMPLIANT, 1212-8, POWERPAK-8
|
SMALL OUTLINE, S-PDSO-C5
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.29.00.95
|
8541.29.00.95
|
Factory Lead Time |
26 Weeks
|
|
Samacsys Manufacturer |
Vishay
|
Vishay
|
Avalanche Energy Rating (Eas) |
5 mJ
|
5 mJ
|
Case Connection |
DRAIN
|
DRAIN
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
100 V
|
100 V
|
Drain Current-Max (ID) |
28 A
|
28 A
|
Drain-source On Resistance-Max |
0.033 Ω
|
0.033 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
S-PDSO-C5
|
S-PDSO-C5
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
5
|
5
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
52 W
|
52 W
|
Pulsed Drain Current-Max (IDM) |
40 A
|
40 A
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Pure Matte Tin (Sn) - annealed
|
Pure Matte Tin (Sn) - annealed
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
|
|
|
Compare SIS892ADN-T1-GE3 with alternatives
Compare SIS892ADN-T1-GE3 with alternatives