SLA24C08-S-3/P vs M24C64-WDW6B feature comparison

SLA24C08-S-3/P Siemens

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M24C64-WDW6B STMicroelectronics

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SIEMENS A G STMICROELECTRONICS
Part Package Code SOIC SOIC
Package Description SOP, TSSOP,
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 0.1 MHz 0.4 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Memory Density 8192 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1024 words 8192 words
Number of Words Code 1000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1KX8 8KX8
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 2.7 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Write Cycle Time-Max (tWC) 8 ms 5 ms
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Length 4.4 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.2 mm
Terminal Finish TIN LEAD
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3 mm

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Compare M24C64-WDW6B with alternatives