SM0511
vs
SMX0511MR-M1
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, CERAMIC, MELF-2
|
ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, M1, MELF-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW DISTORTION
|
LOW DISTORTION
|
| Application |
ATTENUATOR; SWITCHING
|
ATTENUATOR; SWITCHING
|
| Breakdown Voltage-Min |
500 V
|
500 V
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
1.25 pF
|
1.25 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
0.3 Ω
|
0.3 Ω
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
HIGH FREQUENCY TO L BAND
|
HIGH FREQUENCY TO L BAND
|
| JESD-30 Code |
R-CDSO-R2
|
R-CDSO-R2
|
| JESD-609 Code |
e0
|
|
| Minority Carrier Lifetime-Nom |
3 µs
|
3 µs
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
MELF
|
| Pin Count |
|
2
|
| Diode Capacitance-Nom |
|
1.25 pF
|
| Diode Res Test Current |
|
100 mA
|
| Diode Res Test Frequency |
|
100 MHz
|
| Reverse Test Voltage |
|
50 V
|
|
|
|
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