SMBJ170CA
vs
MXLSMBJ170CA
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTERNATIONAL SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Breakdown Voltage-Nom |
199 V
|
199 V
|
Clamping Voltage-Max |
275 V
|
275 V
|
Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
Rep Pk Reverse Voltage-Max |
170 V
|
170 V
|
Surface Mount |
YES
|
YES
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
Package Description |
|
PLASTIC, SMBJ, 2 PIN
|
Additional Feature |
|
HIGH RELIABILITY
|
Breakdown Voltage-Max |
|
209 V
|
Breakdown Voltage-Min |
|
189 V
|
Configuration |
|
SINGLE
|
Diode Element Material |
|
SILICON
|
JEDEC-95 Code |
|
DO-214AA
|
JESD-30 Code |
|
R-PDSO-J2
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
1
|
Non-rep Peak Rev Power Dis-Max |
|
600 W
|
Number of Elements |
|
1
|
Number of Terminals |
|
2
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
-65 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Power Dissipation-Max |
|
1.38 W
|
Qualification Status |
|
Not Qualified
|
Technology |
|
AVALANCHE
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
J BEND
|
Terminal Position |
|
DUAL
|
|
|
|
Compare SMBJ170CA with alternatives
Compare MXLSMBJ170CA with alternatives