SMDJ58C
vs
SMLJ58CE3
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
10
|
1
|
| Part Package Code |
|
DO-214AB
|
| Package Description |
|
R-PDSO-C2
|
| Pin Count |
|
2
|
| Breakdown Voltage-Max |
|
78.7 V
|
| Breakdown Voltage-Min |
|
64.4 V
|
| Breakdown Voltage-Nom |
|
71.55 V
|
| Clamping Voltage-Max |
|
103 V
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-214AB
|
| JESD-30 Code |
|
R-PDSO-C2
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Peak Rev Power Dis-Max |
|
3000 W
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Polarity |
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
|
1.61 W
|
| Qualification Status |
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
|
58 V
|
| Reverse Current-Max |
|
5 µA
|
| Surface Mount |
|
YES
|
| Technology |
|
AVALANCHE
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
C BEND
|
| Terminal Position |
|
DUAL
|
|
|
|
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