SN54S188J
vs
HM1-7602-2
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
HARRIS SEMICONDUCTOR
|
| Package Description |
,
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
60 ns
|
| JESD-30 Code |
|
R-XDIP-T16
|
| JESD-609 Code |
|
e0
|
| Memory Width |
|
8
|
| Number of Terminals |
|
16
|
| Number of Words |
|
32 words
|
| Number of Words Code |
|
32
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
|
32X8
|
| Package Body Material |
|
CERAMIC
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP16,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
0.13 mA
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
TTL
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare SN54S188J with alternatives
Compare HM1-7602-2 with alternatives