SN74ACT72221L50RJ
vs
MK4503N-80
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
THOMSON COMPONENTS-MOSTEK CORP
|
| Part Package Code |
QFJ
|
|
| Package Description |
QCCJ, LDCC32,.5X.6
|
DIP, DIP28,.6
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
25 ns
|
80 ns
|
| Clock Frequency-Max (fCLK) |
20 MHz
|
10 MHz
|
| Cycle Time |
50 ns
|
|
| JESD-30 Code |
R-PQCC-J32
|
R-PDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
9216 bit
|
18432 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
|
| Number of Terminals |
32
|
28
|
| Number of Words |
1024 words
|
2048 words
|
| Number of Words Code |
1000
|
2000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1KX9
|
2KX9
|
| Output Enable |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC32,.5X.6
|
DIP28,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.16 mA
|
0.12 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Standby Current-Max |
|
0.004 A
|
|
|
|
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