SN74AS08DBR vs S54S08F883B feature comparison

SN74AS08DBR Texas Instruments

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S54S08F883B NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC SIGNETICS CORP
Part Package Code SSOP DIP
Package Description SSOP-14 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family AS S
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e4 e0
Length 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.02 A 0.02 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 24 mA 14.25 mA
Prop. Delay@Nom-Sup 5.5 ns 7.5 ns
Propagation Delay (tpd) 5.5 ns 7.5 ns
Schmitt Trigger NO NO
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm
Base Number Matches 1 1
Package Equivalence Code DIP14,.3
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B

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