SNJ54HC00J vs HD74HC00P feature comparison

SNJ54HC00J Rochester Electronics LLC

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HD74HC00P Renesas Electronics Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC RENESAS ELECTRONICS CORP
Part Package Code DIP DIP
Package Description HERMETIC SEALED, CERAMIC, DIP-14 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature LG-MAX
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Length 19.94 mm 19.2 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 135 ns 115 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 5.08 mm 5.06 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 23 ns
Schmitt Trigger NO
Terminal Finish NICKEL PALLADIUM GOLD

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