SP7545JIN
vs
MX7545SD
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
API TECHNOLOGIES CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
DIP,
|
DIP, DIP20,.3
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
R-PDIP-T20
|
R-GDIP-T20
|
| Length |
25.908 mm
|
|
| Linearity Error-Max (EL) |
0.0488%
|
0.0488%
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.334 mm
|
5.08 mm
|
| Settling Time-Nom (tstl) |
2 µs
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
20
|
| ECCN Code |
|
3A001.A.2.C
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
DIP20,.3
|
| Settling Time-Max |
|
2 µs
|
| Supply Current-Max |
|
2 mA
|
| Terminal Finish |
|
GOLD OVER NICKEL
|
|
|
|
Compare SP7545JIN with alternatives
Compare MX7545SD with alternatives