SPAKMC332AMFC16
vs
SPAKMC332GMFC16
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
0.950 X 0.950 INCH, 0.025 INCH PITCH, PLASTIC, QFP-132
|
0.950 X 0.950 INCH, 0.025 INCH PITCH, PLASTIC, QFP-132
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| CPU Family |
68000
|
68000
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G132
|
S-PQFP-G132
|
| Length |
24.13 mm
|
24.13 mm
|
| Number of I/O Lines |
31
|
31
|
| Number of Terminals |
132
|
132
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BQFP
|
BQFP
|
| Package Equivalence Code |
SPQFP132,1.1SQ
|
SPQFP132,1.1SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, BUMPER
|
FLATPACK, BUMPER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
2048
|
2048
|
| Seated Height-Max |
4.572 mm
|
4.572 mm
|
| Speed |
16 MHz
|
16 MHz
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
24.13 mm
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SPAKMC332AMFC16 with alternatives
Compare SPAKMC332GMFC16 with alternatives