SPAKMC332CFVV20 vs SPAKMC332GMPV16 feature comparison

SPAKMC332CFVV20 NXP Semiconductors

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SPAKMC332GMPV16 NXP Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-144 PLASTIC, QFP-132
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 24 24
Bit Size 32 32
CPU Family 68000 68000
Clock Frequency-Max 20 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G144 S-PQFP-G132
Length 20 mm 20 mm
Number of I/O Lines 24 31
Number of Terminals 144 132
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Equivalence Code QFP144,.87SQ,20 QFP144,.87SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (bytes) 2048 2048
Seated Height-Max 1.6 mm 1.6 mm
Speed 20 MHz 16 MHz
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology HCMOS HCMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 20 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 4
Boundary Scan NO
Moisture Sensitivity Level 1
On Chip Program ROM Width 16
ROM (words) 32768
ROM Programmability EEPROM
Supply Current-Max 134 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V

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