SPAKMC332GMPV16 vs SPAKMC332GCFV20 feature comparison

SPAKMC332GMPV16 Motorola Semiconductor Products

Buy Now Datasheet

SPAKMC332GCFV20 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description LFQFP, 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-144
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 16.78 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G144 S-PQFP-G144
Length 20 mm 20 mm
Number of I/O Lines 24 24
Number of Terminals 144 144
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Speed 16.78 MHz 20 MHz
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology HCMOS HCMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 20 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code Yes
CPU Family 68000
Package Equivalence Code QFP144,.87SQ,20
Peak Reflow Temperature (Cel) NOT SPECIFIED
RAM (bytes) 2048
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SPAKMC332GMPV16 with alternatives

Compare SPAKMC332GCFV20 with alternatives