SPC5200CBV400R2 vs STP1100BGA-100 feature comparison

SPC5200CBV400R2 NXP Semiconductors

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STP1100BGA-100 Sun Microsystems Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SUN MICROSYSTEMS INC
Package Description 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 BGA, BGA272,20X20,50
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 2 Days
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 32
Boundary Scan YES YES
Clock Frequency-Max 35 MHz 33.33 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B272 S-PBGA-B272
JESD-609 Code e0
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 272 272
Operating Temperature-Max 85 °C 80 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.54 mm
Speed 400 MHz 100 MHz
Supply Voltage-Max 1.58 V 3.47 V
Supply Voltage-Min 1.42 V 3.14 V
Supply Voltage-Nom 1.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
Part Package Code BGA
Pin Count 272
Bit Size 32
Number of DMA Channels
Number of External Interrupts 15
Number of Serial I/Os
On Chip Data RAM Width
Package Equivalence Code BGA272,20X20,50
RAM (words) 0

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